Semitron PP Polypropylene Created Specifically for the Semiconductor Industry Semitron PP is polypropylene plate developed specifically for demanding Wet Process Semiconductor applications that requires a high level of dimensional stability. Mi ni m al C e n t e r L i n e P o ros ity We have developed proprietary processing methods to minimize the high stress center line porosity that is common with standard polypropylene The plates ranging from 2 to 5 thickness are manufactured to the highest standards for use in the Semiconductor Wet Process industry Key Benef its Minimizes center line porosity common with thicker plates 2 up Delivers Ultra-Clean plate to minimize risk of surface contaminants Lowers overall cost by delivering lower stress plate Plate Size mm. 2.0in50.8mm 610 x 1220 1220 x 3050 2.25in57.15mm 610 x 1220 1220 x 3050 2.5in63.5mm 610 x 1220 1220 x 3050 3.0in76.2mm 610 x 1220 1220 x 3050 4.0in101.6mm 610 x 1220 1220 x 3050 5.0in127mm 610 x 1220 1220 x 3050 Semitron PP Proprietary formulated thick plate PP that delivers low stress low centerline porosity and ultra clean for demanding wet process applications mcam.com Material Comparison Semitron PP Standard PP 0.30 Center Point Deflection Semitron PP Thickness 0.35 Lower is better Sizes Available 0.25 0.20 0.15 0.10 0.05 0 1.00 1.25 1.50 2.00 Plate Thickness inches Data Source Mitsubishi Chemical Advanced Materials Lab MCAMconnect contactmcam.com S em i t ron P P v s St a n d a rd PP Lower Internal Stress allows for accelerated fabrication cycles through faster speeds feeds as well as reducing or eliminating the need to anneal. Semitron PP Plate Standard PP Plate Data Sheet Physical Properties Property Average Value Metric Average Value Imperial Specific Gravity 0.91 gcc 0.91 Water Absorption at Saturation 0.010 0.010 Hardness Shore D 78 78 Tensile Strength 33.1 MPa 4800 psi 25 25 Tensile Modulus Temperature 22.8C 73.0F 2.07 GPa 300 ksi Flexural Strength 41.4 MPa 6000 psi Flexural Modul
us 1.72 GPa 250 ksi Compressive Strength 48.3 MPa 7000 psi Compressive Modulus 1.31 GPa 190 ksi Izod Impact Notched 0.641 Jcm 1.20 ft-lbin Melting Point 162 C 324 F Maximum Service Temperature Air 82.2 C 180 F Deflection Temperature at 0.46 MPa 66 psi 104 C 220 F Deflection Temperature at 1.8 MPa 264 psi 82.2 C 180 F HB HB Thermal Properties Mechanical Properties Elongation at Break Flammability UL94 1 Data represents Mitsubishi Chemical Advanced Materials estimated maximum long-term service temperature based on practical field experience. 2 Specimens 18 thick x 2 diameter or square. 3 Estimated rating based on available data. The UL-94 Test is a laboratory test and does not relate to actual fire hazard. Distributed by All statements technical information and recommendations contained in this publication are presented in good faith and are as a rule based upon tests and such tests are believed to be reliable and practical field experience. The reader however is cautioned that Mitsubishi Chemical Advanced Materials does not guarantee the accuracy or completeness of this information and it is the customers responsibility to determine the suitability of Mitsubishi Chemical Advanced Materials products in any given application. Semitron is a registered trademark of the Mitsubishi Chemical Advanced Materials group of companies. Design and content created by Mitsubishi Chemical Advanced Materials and are protected by copyright law. Copyright Mitsubishi Chemical Advanced Materials. All rights reserved. MCM NA 006 6.24.19
