Skip to content

MCAM Vacuum Chamber Solutions

Semiconductor Vacuum Chamber Solutions Worlds broadest portfolio of polymer solutions for use in vacuum chamber applications Typical Process Tools Etch CVD PVD Ion Implant Material Solutions Key Properties K etron 1000 PEEK For use in lower power lower heat 300F or indirect plasma chamber applications such as wafer mobility. D uratron CU60 PBI For use in high power high heat 750F applications or indirect chamber applications when in the presence of Oxygen plasma. D uratron T4203 PAI For use in medium power medium heat 500F applications or indirect chamber applications in presence of Oxygen plasma. S emitron MPR-1000 For use in high power medium heat 520F applications. Best in class when in presence of Oxygen plasma. MCAMconnect General Trends Vacuum Chamber Increasing energy in plasma chambers M ore aggressive plasma chemistries introduction of Oxygen into the chambers P inpoint material selection on a per application basis to maximize cost vs. performance R eplacement of polyimide for reduced cost increased performance C areful use of ceramics Quartz due to cost breakage Increased requirements for ionic purity due to reduced node size Typical Applications S crews Pins Valve Housings C lamp Trench Rings S hower Heads Various Etch CVD Parts Competitive Quartz vs. Semitron MPR-1000 Competitive Quartz left is much more brittle than Semitron MPR-1000 right often chipping in vacuum chambers Introducing Semitron MPR-1000 Semitron MPR-1000 was developed to provide engineers with a viable polymer-based option when confronted with the increasing demands in vacuum plasma based chamber design due to use of Oxygen to clean the chamber and the rapidly increasing electrode power. Product Features E xcellent plasma resistance in Oxygen plasma approaches Quartz 1 2-25X better than polyimide in Oxygen plasma E xcellent chip resistance durability machinability compared to Quartz L owest overall cost of any polymer solution E x

cellent ionic purity Chamber Conditions 1KW CF 1200 sccm 0.32 Torr 50 hours 10 Percent Weight Loss in Cf4 Plasma - Low Energy M ost advanced engineering plastics perform similar in freon plasma gases 8 T he mode of degradation is mechanical erosion a function of surface hardness type of solid crystalline vs amorphous 6 4 2 0 4.3 3.5 4.3 4.3 Polyimide PEEK Duratron PAI Semitron MPR-1000 PEEK PAI Percent Weight Loss In O2 Plasma - 2kw A dvanced engineering plastics mode of degradation in Oxygen plasma is catastrophic oxidation S emitron MPR-1000 was developed to withstand the typical erosion experienced in Oxygen plasma chambers S emitron MPR-1000 displays 10X better results than PEEK and 6X better results than polyimide in a 2KW Oxygen plasma chamber and up to 25X better results than polyimide at 2.5KW Oxygen plasma Polyimide Chamber Conditions 2KW O2 1200 sccm Semitron MPR-1000 0.30 Torr 50 hours 13.56 MHz 60 50 40 30 20 10 0 36 56 30 5.7 Polyimide PEEK Duratron PAI Semitron MPR-1000 Ionic Purity Data Alu min um Al Ba riu m Ba Ca lciu m Ca Ch rom ium Cr Co pp er C u Iro n F e Lea d Pb Lit hiu m Li Ma gn esi um M g Ma ng ane se M n Nic kel Ni Po tas si u m K So di u m Na St r on tiu m Sr Tit ani um Ti Zin c Z n Ionic Purity Data Semitron MPR-1000 0.14 0.07 2.8 2.6 0.14 2.3 Ketron PEEK 0.38 0.02 8 0.49 0.2 6 Standard Polyimide 0.47 0.05 0.01 0.01 0.05 Semitron MPR-1000 0.14 0.07 2.8 2.6 Standard Polyimide 17.68 1.88 0.38 0.38 0.3 0.11 0.36 0.77 4.4 0.04 0.12 0 0.005 0.005 0.8 0.2 0.42 1.6 480 0.06 0.18 0.15 0.36 0.05 0.05 0.28 0.02 0.02 0.13 0.44 0.05 0.05 0.02 0.14 2.3 0 0 0.3 0.11 0.36 0.77 4.4 0.04 0.12 0 1.88 13.55 1.88 1.88 10.54 0.75 0.75 4.89 16.56 1.88 1.88 0.75 Thermal Prop. Mechanical Properties Duratron T4203 PAI Semitron MPR-1000 Ketron 1000 PEEK Standard Polyimide Material Comparison Guide Electrical Properties 0 Adjusted for Mass Loss During Erosion 2.5 KW 2000 sccm O2 by Total Digestion Tensile Strength psi D638 12500 16000

16000 17000 20000 Tensile Modulus psi D638 - 850000 630000 1200000 600000 Flexural Strength psi D790 16000 32000 25000 24000 24000 Flexural Modulus psi D790 450000 950000 600000 1050000 600000 Hardness Rockwell D785 M82 M125 M100 M106 M120 Moisture Absorption 24hrs 73F D5702 0.24 0.40 0.10 0.28 0.40 Moisture Absorption Saturation D570 1.5 5.0 0.5 3.4 1.7 E-831 TMA 3.0 x 10-5 1.3 x 10-5 2.6 x 10-5 1.5 x 10-5 1.7 x 10-5 D648 632 800 320 534 532 CLTE Heat Deflection Temperature 66psi F 2 Dielectric Constant 1 Hz D150 4.20 3.20 3.30 3.68 4.20 Dissipation Factor 1 Hz D150 0.0034 0.0030 0.0030 0.0080 0.0260 Dielectric Strength D149 560 550 480 570 580 - excellent good fair excellent good Ionic Purity 1 Data represents our estimated maximum long-term service temperature based on practical field experience. Distributed by 0 Duratron CU60 PBI 2 Specimens 18 thick x 2 diameter or square. 3 Estimated rating based on available data. The UL-94 Test is a laboratory test and does not relate to actual fire hazard. MCAMconnect All statements technical information and recommendations contained in this publication are presented in good faith and are as a rule based upon tests and such tests are believed to be reliable and practical field experience. The reader however is cautioned that Mitsubishi Chemical Advanced Materials does not guarantee the accuracy or completeness of this information and it is the customers responsibility to determine the suitability of Mitsubishi Chemical Advanced Materials products in any given application. Duratron Ketron Semitron and Kyron are a registered trademark of the Mitsubishi Chemical Advanced Materials group of companies. Design and content created by Mitsubishi Chemical Advanced Materials and are protected by copyright law. Copyright Mitsubishi Chemical Advanced Materials. All rights reserved. MCM NA 6I 6.12.19