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MCAM Back-End Test & Electronic Fixturing Solutions

Semiconductor Back-End Test Electronic Fixturing Solutions Worlds broadest portfolio of polymer solutions for use in IC Chip test fixturing applications Applications Burn-In Test Sockets Electronic Fixturing Standard Materials Semitron MDS 100 Semitron MP 370 Duratron T4203 PAI Duratron T5030 PAI Ketron 1000 PEEK Duratron U1000 PEI Kyron EPM-2204 Kyron GC-100 Electrostatic Dissipative Materials Semitron ESd 520HR PAI A Semitron ESd 490HR PEEK A Semitron ESd HPV PEEK D Semitron ESd 480 PEEK D Semitron ESd 420V PEI D Semitron ESd 420 PEI D Semitron ESd 410C PEI C Semitron ESd 300 PET D Semitron ESd 225 POM D Semitron ESd POM CNT D A Anti-Static D Static Dissipative C Conductive MCAMconnect Re p re se Pit ntat ch ive le Mi nim al Ho ize eS vic De Years 2003 90 nm 0.6 mm 0.8 mm 2006 65 nm 0.4 mm 0.5 mm 2009 45 nm 0.25 mm 0.3 mm 2012 22 nm 0.18 mm 0.2 mm 2015 14 nm 0.12 mm 0.15 mm 2017 7 nm 0.10 mm 0.15 mm 2018 10 nm 0.08 mm 0.08 mm General Trends Driven by the miniaturization of IC devices the Back-End Test industry is pushing material science to the brink of polymeric capability. The smaller IC device requires thinner cross sections thinner cross sections then require stiffer materials to withstand the testing parameters. The challenge is to offer increased stiffness while maintaining the machinability of the decreasing features such as hole size and pitch. Test Socket Trends Increased IO Count R eduction in Hole Pitch Size Thinner Cross Sections Typical Decreasing Features Over Time Mitsubishi Chemical Advanced Materials proprietary material technologies are opening the doors to new design advancements. Critical Properties In order to deliver a functional test socket under the changing conditions described the engineer must pay particular attention to the most critical properties that effect the machinability and the stability of the test socket. Flexural Modulus Critical for managing the robustness of the finish

ed socket under test conditions Tensile Elongation Critical for controlling the accuracy of holes during machining CLTE Critical for providing dimensional stability over a varied temperature range during usage Polymer Melting Point Critical for clean thru holes during drilling Moisture Absorption Critical for maintaining dimensional stability 12 Semitron MDS 100 Featured ProductsMaterials Kyron GC-100 Semitron MDS 100 Kyron GC-100 N on fiber filled ultra-stiff polymer delivering 8 H ighest flexural modulus non fiber filled product exceptional dimensional stability E xtremely low CLTE translates to excellent dimensional stability D eveloped to complement Semitron MDS-100 with thicker cross sections 6mm 9mm 12mm Kyron A vailable in thin cross sections ranging from 1mm to 6mm thick overDuratron EPM-2204 ow CTE providesSemitron stability a wide range Duratron L T4203 PAI T5030 PAI of test conditions MP 370 4 V ery low moisture absorption allowing for excellent dimensional stability Duratron Injection moldedU1000 platePEI provides a low-cost Ketron alternative to expensive polyimides 1000 PEEK E xcellent machinability for fine features L ow tensile elongation allows for increased accuracy in hole placement 0 2.5 PoIyimide 5.0 7.5 Machinability Rating A formula which combines heat resistance ductility fill The key components in next generation socket design Test Socket Material Selection Grid Polymeric Stability vs. Machinability of Fine Features Socket Type Basic Challenging Demanding Hole Size 0.4 mm 0.2-0.35 mm 0.18 mm Pitch Size 0.6 mm 0.25-0.5 mm 0.25 mm Polymeric Stability A formula which combines CLTE stiffness 12 Semitron MDS 100 Kyron GC-100 8 Kyron EPM-2204 Duratron T5030 PAI 4 Ketron 1000 PEEK Semitron MP 370 Duratron T4203 PAI Duratron U1000 PEI PoIyimide 0 2.5 5.0 Machinability Rating A formula which combines heat resistance ductility fill Socket Type Basic Challenging Demanding 7.5 Conductive Range Dissipative Range ESd Performance vs. T

emperature 102 500F 400F OHMSquare 1010 106 Semitron ESd 480HPV Semitron ESd 420 Semitron ESd 420V Ketron CA30 PEEK Semitron ESd 410C Dissipative Range Semitron MP370 Semitron MDS 100 Kyron EPM-2204 Kyron GC-100 Duratron T4203 PAI Duratron T5030 PAI 102 grey white grey tan mustard dark brown D638 640000 1500000 106 Color Tensile Modulus psi 500F Flexural ModulusKetron psi CA30 PEEK D790 Tensile Elongation CLTE XSemitron 10-5 D638 400F Anti-Static Range - OHMSquare Mechanical Properties Semitron ESd 490HR Semitron ESd 300 Semitron ESd 225 Material Comparison Guide Thermal Prop. 1012 Semitron ESd 520HR Semitron ESd 500HR Conductive Range Electrical Properties Anti-Static Range 480HPV Semitron ESd1420000 ESd 420 Semitron 3.0 1.5 Semitron ESd 420V 625000 D5701 Tg Glass Transition F D3418 Heat Deflection Temperature 264psi F Dielectric Constant 106 Hz 1012 Semitron ESd 520HR 720000 1100000 600000 ESd 500HR Semitron 750000 1100000 600000 Semitron ESd 490HR 1000000 980000 21.0 3.0 10.0 4.0 2.5 2.0 1.9 1.7 0.9 0.11 ESd 300 0.10 Semitron Semitron ESd 225 0.37 0.10 0.40 0.30 - 527 527 ESd 410C E-831 TMA Moisture Absorption 24hrs 73F 1010 2.5 320 - 289 D648 300 410 410 445 532 530 D150 4.13 3.37 3.50 3.39 4.20 4.40 Dissipation Factor 10 Hz D150 0.004 0.007 0.005 0.005 0.026 0.050 Surface Resistivity sq. ANSIESd STM 11.11 13 10 10 14 10 13 10 10 13 1013 D149 376 - 400 347 580 700 Conductive Range 6 Dielectric Strength Dissipative Range 13 Anti-Static Range 1 Specimens 18 thick x 2 diameter or square. Distributed by MCAMconnect All statements technical information and recommendations contained in this publication are presented in good faith and are as a rule based upon tests and such tests are believed to be reliable and practical field experience. The reader however is cautioned that Mitsubishi Chemical Advanced Materials does not guarantee the accuracy or completeness of this information and it is the customers responsibility to dete

rmine the suitability of Mitsubishi Chemical Advanced Materials products in any given application. Duratron Ketron Semitron and Kyron are a registered trademark of the Mitsubishi Chemical Advanced Materials group of companies. Design and content created by Mitsubishi Chemical Advanced Materials and are protected by copyright law. Copyright Mitsubishi Chemical Advanced Materials. All rights reserved. MCM NA 6I 6.12.19